The second annual LTS 2022 will be held online at a confirmed date in the future. The conference will address current and emerging technologies in the field of Low Temperature Soldering and Interconnections.
Presentations are invited on materials and manufacturing technologies associated with low temperature manufacturing and assembly of printed boards (< 210 degrees C), including, but not limited to the following:
Presentations should be process-focused and free from commercial bias. A conference template is available. Presentations should be 30 minutes long with 10 minutes for Questions and Answers.