The second LTS will be held online at a confirmed date in the future. The conference will address current and emerging technologies in the field of Low Temperature Soldering and Interconnections.
Presentations are invited on materials and manufacturing technologies associated with low temperature manufacturing and assembly of printed boards (< 210 degrees C), including, but not limited to the following:
H-Technologies
Fraunhofer IZM
Intel Corporation
© LTS Conference 2022