The next LTS start date
is to be confirmed

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The second LTS will be held online at a confirmed date in the future. The conference will address current and emerging technologies in the field of Low Temperature Soldering and Interconnections.

Call for Abstracts

Presentations are invited on materials and manufacturing technologies associated with low temperature manufacturing and assembly of printed boards (< 210 degrees C), including, but not limited to the following:

Conference committee

Jennie Hwang

Jennie S. Hwang


Tanja Braun

Tanja Braun

Fraunhofer IZM

Kevin Byrd

Kevin J. Byrd

Intel Corporation

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