The next LTS start date
is to be confirmed
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The second LTS will be held online at a confirmed date in the future. The conference will address current and emerging technologies in the field of Low Temperature Soldering and Interconnections.
Call for Abstracts
Presentations are invited on materials and manufacturing technologies associated with low temperature manufacturing and assembly of printed boards (< 210 degrees C), including, but not limited to the following:
- Bi-based materials
- Non-Bi-based materials
- Conductive adhesives
- Plating material and surface finishes
- Reflow and curing systems (including equipment, techniques, processes)
- Thermal profiling
- Selective soldering of LTS materials
- Wave soldering of LTS materials
- Reliability of LTS materials
- Electromigration of LTS materials
- Tin whisker of LTS materials
- Sustainability
- Environmentally-friendly materials
- Environmentally-friendly processes
- Energy saving
- Cost ownership
- Modeling of materials behavior for lifetime prediction
Conference committee
Jennie S. Hwang
H-Technologies
Tanja Braun
Fraunhofer IZM
Kevin J. Byrd
Intel Corporation