Conference Program

TRACK ONE

EST	GMT	Speaker	Presentation	Moderator	Co-Moderator
09:00	14:00	Tadashi Kosuga Lenovo	Implement Low Temperature Solders throughout Lenovo manufacturing.
09:30			Q&A	Trevor Galbraith	Tanja Braun
09:45	14:45	Richard Boyle Henkel	Electrically Conductive Adhesives v Solder: Which solution?
10:15			Q&A	Trevor Galbraith	Tanja Braun
10:30			Coffee Break
11:00	16:00	Gerjan Diepstraten ITWEAE	Challenges of a low temperature solder in selective soldering process.
11:30			Q&A	Trevor Galbraith	Tanja Braun
11:45	16:45	Mike Hayward ECD	Measuring and Controlling Machine Based Soldering Processes: The Impact of LTS.
12:15			Q&A	Trevor Galbraith	Jennie S. Hwang
12:30			Lunch
13:30	18:30	Jasbir Bath Koki Solder America	Development of Low-Melting Point Lead-free SnBiAg Solder Paste with Improved Surface Insulation Resistance Reliability at Low Reflow Soldering Temperatures.
14:00			Q&A	Trevor Galbraith	Jennie S. Hwang
14:15	19:15	Prof. Ephraim Suhir PSU Portland, OR	Inhomogeneous bonding in low-temperature-soldering technologies.
14:45			Q&A	Trevor Galbraith	Jennie S. Hwang
15:00			Coffee Break
15:30	20:30	Dr. Ian Tevis SAFI_Tech, Inc.	Lower Temperature Soldering Without Changing Solder Alloy Composition Using Supercooled Liquid Metal.
15:45			Q&A	Trevor Galbraith	Kevin J. Byrd
16:00	21:00	Alan Plant MacDermid Alpha	Using LTS for Soldering Through Hole Components.
16:30			Q&A	Trevor Galbraith	Kevin J. Byrd
16:45			Conference Ends

TRACK TWO

EST	GMT	Speaker	Presentation	Moderator	Co-Moderator
9:45	14:45	Evonne Lim Heraeus Singapore	A Study on Interfacial Intermetallic Phases at Sn-Bi Solder Joint.
10:15			Q&A	Keith Bryant	Bob Willis
10:30			Coffee Break
11:00	16:00	Andreas Reinhardt SEHO GmbH	BSA solder for wave soldering – requirements and energetic effect.
11:30			Q&A	Keith Bryant	Bob Willis
11:45	16:45	Vinzenz Bissig Essemtec AG	Challenges in jetting and dispensing of low-temperature solder paste.
12:15			Q&A	Keith Bryant	Bob Willis
12:30			Lunch
13:30	18:30	Steven Teliszewski Interflux NV	Practical experiences with a low melting point alloy in wave and selective soldering.
14:00			Q&A	Keith Bryant	Bob Willis
14:15	19:15	Hans-Jürgen Funke nexperia	Low Temperature Soldering Application Study.
15:00			Coffee Break
15:30	20:30	Claire Hotvedt Indium Corporation	Reducing Reflow Temperature and Retaining Material Properties with Mixed Powder Solder Technology.
15:45			Q&A	Keith Bryant	Bob Willis
16:00	21:00	Vahid Akhavan Novacentrix, Inc.	Circumventing the Thermal Challenges with Reflow Using High Powered Flash Lamps.
16:30			Q&A	Keith Bryant	Bob Willis
16:45			Conference Ends

Workshop

Practical Use of Low Temperature Solder, Assembly, Reflow & Inspection Bob Willis

Thursday 17th June, 9am - 12 noon EST

Join us for a practical look at the advantages and use of Low Temperature Soldering (LTS) in this special half day workshop. The session will be presented by Bob Willis past Global SMT columnist and training and consultancy provider to the electronics assembly industry worldwide.

Workshop

Practical Use of Low Temperature Solder, Assembly, Reflow & Inspection Bob Willis

Thursday 17th June, 9am - 12 noon EST

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