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The conference features a keynote speech from Tadashi Kosuga, who describes how low temperature soldering technology was introduced across the range of Lenovo computer products.

Two day track

The keynote is followed by two parallel tracks of 14 presentations.

Presenters will discuss the latest alloys, fluxes and materials used in the low-temperature soldering process. Mixed powders, inhomogeneous bonds, intermetallic phase changes and SIR behavior will be examined.


The following day, on June 17th, Bob Willis will host a workshop “Practical Use of Low Temperature Solder, Assembly, Reflow & Inspection”.